CYKY diamond Single Side Lapping/Polishing machines SSP-50DPAW feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance.
diamond Single Side Lapping Application:
• Sapphire Substrate / Wafer
• Semiconductor Wafer
• Tungsten Carbide Parts
• Ceramic Parts
• Valves
• Crystal Glass
• Oscillator Parts
technical parameter:
Items | SSP-36DPAW | SSP-50DPAW |
|
Polishing plate | Plate material | Oxygen free Cu , Resin-Cu | Oxygen free Cu |
|
Or Tin plate (*option) | or Tin plate(*option) |
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Plate size | Φ910mm | Φ1240mm |
|
Revolution control | By inverter. | Home position. |
|
Plate cooling | Cooling water jacket | Cooling water jacket |
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Pressure plate | P. Plate | 4 axles. | 4 axles.
(driving force system individually) |
|
|
Block size | 360mmΦ | 485mmΦ |
|
Applied pressure | By cylinder | By cylinder |
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Work block | - | Auto Centering |
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Facing unit | Mounting type. | Square type. |
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Capacity / batch | 4 inch wafer x 24 Pcs | 4 inch wafer x 40 Pcs |
|
6 inch wafer x 12 Pcs | 6 inch wafer x 24 Pcs |
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Utility | Electricity | AC220V, 3Phase, 60Hz | AC220V, 3Phase, 60Hz |
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Pneumatic | 0.5~0.8 Mpa | 0.5~0.8 Mpa |
|
Etc | Machine Size | 1350 *2250 *1920 mm | 1640 *3029 *2575 mm |
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Machine Weight | 3,500Kg. | 5,500Kg. |
|
Controller | Touch Screen (Proface) | Touch Screen (Proface) |
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Signal lamp with alarm |
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